Ceramics Hard Glass
Silicone Adhesive
Au-plated
Au-plated
0.25g(TYP)
K
A
Die Heat Sink
Protection Device
3
SOLDERING
Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat 180 to 200°C
60sec Max Above 220°C
120sec Max
260°CMax 10sec Max
Full PDF Text Transcription for NCSU035C (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
NCSU035C. For precise diagrams, and layout, please refer to the original PDF.
ree Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant SPECIFICATIONS NICHIA STS-DA1-5276A <Cat.No.180622> (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Forward Current IF 700 Pulse Forward Current IFP 1000 Allowable Reverse Current IR 85 Power Dissipation PD 2.73 Operating Temperature Topr -10~85 Storage Temperature Tstg -40~100 Junction Temperature TJ 130 * Absolute Maximum Ratings at TS=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%.