NXP Semiconductors BAP50-03
The marking bar indicates the cathode (see Table 1).FEATURES AND BENEFITS
● Low diode capacitance● Low diode forward resistance 1.3
APPLICATIONS
● General RF application NXP Semiconductors BAP50-03 Silicon PIN diode 2 Pinning information Table 1. Discrete pinning PinDESCRIPTION
1 cathode 2 anode Simplified outline Graphic symbol 1 2 Top view sym006 3 Ordering information Table 2. Ordering information Type number Package NameDESCRIPTION
BAP50-03 SC-76 plastic surface-mounted package; 2 leads Version SOD323 4 Marking Table 3. Marking code Type number BAP50-03 Marking code A8[1] [1] 5 Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VR reverse voltage - 50 V IF forward current - 50 mA Ptot total power dissipation Tsp ≤ 90 °C - 500 mW Tstg storage temperature -65 +150 °C Tj junction temperature -65 +150 °C 6 Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to solder point Conditions Typ Unit 85 K/W BAP50-03 Product data sheet All information provided in this document is subject to legal disclaimers.