NXP Semiconductors BAP50-04W
This data sheet contains the design target or goal specifications for product development. This data sheet contains preliminary data, and supplementary data will be published at a later date.| Part No. | BAP50-04W |
|---|---|
| Datasheet | BAP50-04W Download |
| Manufacturer |  NXP Semiconductors |
| Description | General purpose PIN diode |
| Buy | Stock & Price |
FEATURES
● Two elements in series configuration in a small SMD plastic package● Low diode capacitance
● Low diode forward resistance.
APPLICATIONS
● General RF applications.DESCRIPTION
Two planar PIN diodes in series configuration in an SOT323 small SMD plastic package. 1 Top view 2 handbook, halfpage BAP50-04W PINNING PIN 1 2 3DESCRIPTION
anode cathode common connection 3 3 1 2 MAM391 Marking code: 6W-. Fig.1 Simplified outline (SOT323) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode VR IF Ptot Tstg Tj continuous reverse voltage continuous forward current total power dissipation storage temperature junction temperature Ts = 90 °C − − − −65 −65 50 50 240 +150 +150 V mA mW °C °C PARAMETER CONDITIONS MIN. MAX. UNIT 2001 Jan 29 2 Philips Semiconductors Product specification General purpose PIN diodeELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified. SYMBOL Per diode VF VR IR Cd forward voltage reverse voltage...
