NXP Semiconductors BAQ800
This package is hermetically sealed and stress free as coefficients of expansion of all used parts are matched.FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Available in ammopack.
APPLICATIONS
● RF attenuator with low distortion for frequencies above 100 kHz. Fig.1 Simplified outline (SOD81) and symbol. handbook, 4 columns BAQ800DESCRIPTION
Cavity free cylindrical glass package through Implotec™(1) technology. (1) Implotec is a trademark of Philips. k a MAM123 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL VRRM VR IF(AV) PARAMETER repetitive peak reverse voltage continuous reverse voltage average forward current Ttp = 25 °C; lead length = 10 mm; see Fig.2 Tamb = 60 °C; printed-circuit board mounting (see Fig.17); see Fig.3 Tstg Tj storage temperature junction temperature CONDITIONS MIN. − − − − −65 −65 MAX. 100 100 1.25 600 +175 +150 V V A mA °C °C UNIT 1997 Aug 26 2 Philips Semiconductors Product specification AM PIN diode BAQ800ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified; all characteristics must be tested in the dark because of the light sensitivity of this product.