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BAQ806 - AM PIN diode

Datasheet Summary

Description

DO-214AC surface mountable package with glass passivated chip.

The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

Fig.1 Simplified outline (SOD106) and symbol.

Features

  • Glass passivated.
  • High maximum operating temperature.
  • Low leakage current.
  • Excellent stability.
  • UL 94V-O classified plastic package.
  • Shipped in 12 mm embossed tape.

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Datasheet preview – BAQ806

Datasheet Details

Part number BAQ806
Manufacturer NXP
File Size 74.63 KB
Description AM PIN diode
Datasheet download datasheet BAQ806 Datasheet
Additional preview pages of the BAQ806 datasheet.

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Full PDF Text Transcription

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DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D168 BAQ806 AM PIN diode Product specification File under Discrete Semiconductors, SC10 1998 Aug 03 Philips Semiconductors Product specification AM PIN diode FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape. APPLICATIONS • RF attenuator with low distortion for frequencies above 100 kHz. handbook, 4 columns BAQ806 DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. cathode band k a Top view Side view MSA474 Fig.1 Simplified outline (SOD106) and symbol.
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