Datasheet Details
| Part number | BAQ806 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 74.63 KB |
| Description | AM PIN diode |
| Datasheet |
 BAQ806 Datasheet
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General Description
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
Fig.1 Simplified outline (SOD106) and symbol.
Key Features
- Glass passivated.
- High maximum operating temperature.
- Low leakage current.
- Excellent stability.
- UL 94V-O classified plastic package.
- Shipped in 12 mm embossed tape.