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BC868 - NPN medium power transistor

General Description

NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.

Table 1.

Key Features

  • High current.
  • Two current gain selections.
  • High power dissipation capability.
  • Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061).
  • Leadless very small SMD plastic package with medium power capability (SOT1061).
  • AEC-Q101 qualified 1.3.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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BCP68; BC868; BC68PA 20 V, 2 A NPN medium power transistors Rev. 8 — 18 October 2011 Product data sheet 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number[1] Package NXP BCP68 SOT223 BC868 SOT89 BC68PA SOT1061 JEITA SC-73 SC-62 - JEDEC TO-243 - PNP complement BCP69 BC869 BC69PA [1] Valid for all available selection groups. 1.2 Features and benefits  High current  Two current gain selections  High power dissipation capability  Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)  Leadless very small SMD plastic package with medium power capability (SOT1061)  AEC-Q101 qualified 1.