BCP55 Description
NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Product overview Type number[1] Package NXP BCP55 SOT223 BCX55 SOT89 BC55PA SOT1061 JEITA SC-73 SC-62 - [1] Valid for all available selection groups. JEDEC TO-243 - PNP plement BCP52 BCX52 BC52PA 1.2.
BCP55 Key Features
- High current
- Three current gain selections
- High power dissipation capability
- Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
- Leadless very small SMD plastic package with medium power capability (SOT1061)
- AEC-Q101 qualified