Datasheet Details
| Part number | BY278 |
|---|---|
| Manufacturer | NXP |
| File Size | 52.08 KB |
| Description | Damper diode |
| Datasheet |
 BY278 Datasheet
|
|
|
| Part number | BY278 |
|---|---|
| Manufacturer | NXP |
| File Size | 52.08 KB |
| Description | Damper diode |
| Datasheet |
BY278 Datasheet
|
|
|
|
Rugged glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
Fig.1 Simplified outline (SOD64) and symbol.