BY559X-1500U Datasheet | NXP Semiconductors

FEATURES - Low forward volt drop - Low forward recovery voltage - Fast switching - Soft recovery characteristic - High thermal cycling performance - Isolated mounting tab SYMBOL QUICK REFERENCE DATA VR = 1500 V VF ≤ 1.4 V Vfr ≤ 10 V trr ≤ 120 ns IF(PEAK) = 10 A IFSM ≤ 150 A k 1 a 2 GENERAL DESCRIPTION A double diffused rectifier diode in a plastic envelope, featuring fast forward and reverse recovery and low forward voltage. The device is intended for use as a damper diode in horizontal deflection circuits of large screen monitors and workstations . The BY559X series is supplied in the conventional leaded SOD113 package. PINNING PIN 1 2 tab DESCRIPTION cathode anode isolated SOD113 case LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL VRRM VRWM IF(PEAK) IFRM IFSM Tstg Tj PARAMETER Peak repetitive reverse voltage Crest working reverse voltage Peak working forward current Peak repetitive forward current Peak non repetitive forward current Storage temperature Operating junction temperature CONDITIONS MIN. -40 MAX. 1500 1300 10 150 160 150 150 UNIT V V A A A ˚C ˚C f = 130 k Hz; t = 100 µs t = 10 ms sinusoidal; Tj = 150 ˚C prior to surge; with reapplied VRWM(max) ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from both terminals to external heatsink CONDITIONS f = 50-60 Hz; sinusoidal waveform; R.H. ≤ 65% ; clean and dustfree MIN. TYP. MAX. 2500 UNIT V Cisol Capacitance from both terminals f = 1 MHz to external heatsink - 10 - p F September 1998 Rev 1.100 Philips Semiconductors Objective specification Damper diode fast, high-voltage THERMAL RESISTANCES SYMBOL Rth j-hs Rth j-a PARAMETER Thermal resistance junction to heatsink Thermal resistance junction to ambient CONDITIONS with heatsink pound in free air. MIN. - BY559X-1500U TYP. 55 MAX. 3.6 - UNIT K/W K/W STATIC CHARACTERISTICS Tj = 25 ˚C...