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BYG70

Manufacturer: NXP Semiconductors

BYG70 datasheet by NXP Semiconductors.

BYG70 datasheet preview

BYG70 Datasheet Details

Part number BYG70
Datasheet BYG70_PhilipsSemiconductors.pdf
File Size 35.89 KB
Manufacturer NXP Semiconductors
Description Fast soft-recovery controlled avalanche rectifiers
BYG70 page 2 BYG70 page 3

BYG70 Overview

DO-214AC surface mountable package with glass passivated chip. cathode band k a MSA474 Fig.1 Simplified outline (DO-214AC; LIMITING VALUES In accordance with the Rating System (IEC 134).

BYG70 Key Features

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • UL 94V-O classified plastic package
  • Shipped in 12 mm embossed tape
NXP Semiconductors logo - Manufacturer

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