Datasheet4U Logo Datasheet4U.com
NXP Semiconductors logo

BYG70J

Manufacturer: NXP Semiconductors

BYG70J datasheet by NXP Semiconductors.

BYG70J datasheet preview

BYG70J Datasheet Details

Part number BYG70J
Datasheet BYG70J_PhilipsSemiconductors.pdf
File Size 35.89 KB
Manufacturer NXP Semiconductors
Description Fast soft-recovery controlled avalanche rectifiers
BYG70J page 2 BYG70J page 3

BYG70J Overview

DO-214AC surface mountable package with glass passivated chip. cathode band k a MSA474 Fig.1 Simplified outline (DO-214AC; LIMITING VALUES In accordance with the Rating System (IEC 134).

BYG70J Key Features

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • UL 94V-O classified plastic package
  • Shipped in 12 mm embossed tape
NXP Semiconductors logo - Manufacturer

More Datasheets from NXP Semiconductors

View all NXP Semiconductors datasheets

Part Number Description
BYG70 Fast soft-recovery controlled avalanche rectifiers
BYG70D Fast soft-recovery controlled avalanche rectifiers
BYG26 SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26D SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26G SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26J SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG50 Controlled avalanche rectifiers
BYG50D Controlled avalanche rectifiers
BYG50G Controlled avalanche rectifiers
BYG50J Controlled avalanche rectifiers

BYG70J Distributor

Datasheet4U Logo
Since 2006. D4U Semicon. About Datasheet4U Contact Us Privacy Policy Purchase of parts