PIP3224-DC Datasheet | NXP Semiconductors

Description Monolithic temperature and overload protected dual high-side power switch based on TOPFET™ Trench technology in a 7-pin surface mount plastic package. 1.2 Features s s s s s s s s .. Very low quiescent current Power Trench MOS™ Overtemperature protection Over and undervoltage protection Reverse battery protection Low charge pump noise Loss of ground protection Negative load clamping s s s s s s s s CMOS logic patibility Current limitation Latched overload protection ESD protection for all pins Diagnostic status indication Off-state open load detection Load dump protection Internal ground resistor. 1.3 Applications s 12 and 24 V grounded loads s Inductive loads s High inrush current loads s Replacement for relays and fuses. 1.4 Quick reference data Table 1: Symbol RBLon IL IL(nom) IL(lim) VBG(oper) Quick reference data Parameter battery-load on-state resistance load current nominal load current (ISO) self-limiting load current battery-ground operating voltage Min 3.6 8 5.5 Max 90 4 16 35 Units mΩ A A A V Philips Semiconductors Dual channel high-side TOPFET™ 2. Pinning information S mb I1 P I2 1 2 3 4 5 6 7 L2 L1 Front view MBK128 03pa68 No connection can be made to pin 4 (cropped). P represents protection circuitry. Fig 1. Pinning; SOT427 (D2-PAK). Fig 2. Symbol; (Dual High-Side Switch) TOPFETTM. 2.1 Pin description Table 2: Symbol L1 G I1 B S I2 L2 [1] [2] Pin description Pin 1 2 3 4 5 6 7 mb I/O O I O I O [2] [1] [2] Description load 1 circuit mon ground input 1 battery status input 2 load 2 mounting base Pin 4 is cropped and cannot be connected to the PCB by surface mounting. The battery is connected to the mounting base. 3. Ordering information Table 3: Ordering information Package Name PIP3224-DC D2-PAK Description Version Plastic single-ended surface mounted package (Philips version of D2-PAK); SOT427 7 leads (one lead cropped) Type number 9397 750 12362 © Koninklijke Philips Electronics N.V. 2004. All...