PUSB3AB6 Datasheet PDF - NXP ESD protection Specs

PUSB3AB6 - ESD protection

Datasheet Summary

Description

The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB combination, Secure Digital (SD) card 3.0 and Thunderbolt interfaces against ElectroStatic Discharge (ESD).

The device includes six high-level ESD protection diode structures.

Features

System-level ESD protection for USB 2.0 and USB 3.1 combination, SD card 3.0 and Thunderbolt interfaces.
Supports SuperSpeed USB 3.1 at 10 Gbps.
Line capacitance of only 0.15 pF for each channel.
All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 15 kV exceeding IEC 61000-4-2, level 4.
Matched 0.5 mm trace spacing.
Design-friendly pass-through signal routing 1.3.

Datasheet Details

Part number	PUSB3AB6
Manufacturer	NXP
File Size	1.01 MB
Description	ESD protection
Datasheet	PUSB3AB6 Datasheet
Additional preview pages of the PUSB3AB6 datasheet.

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Full PDF Text Transcription

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XSON7 PUSB3AB6 ESD protection for ultra high-speed interfaces Rev. 1 — 3 March 2015 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB combination, Secure Digital (SD) card 3.0 and Thunderbolt interfaces against ElectroStatic Discharge (ESD). The device includes six high-level ESD protection diode structures. They protect sensitive transmitters and receivers for ultra high-speed signal lines. The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1) Surface-Mounted Device (SMD) plastic package. All signal lines are protected by a special diode configuration offering snapback ultra low line capacitance of only 0.15 pF.

Published: Jun 24, 2015 |