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PUSB3FR6 Datasheet

Manufacturer: NXP Semiconductors
PUSB3FR6 datasheet preview

PUSB3FR6 Details

Part number PUSB3FR6
Datasheet PUSB3FR6-NXP.pdf
File Size 345.78 KB
Manufacturer NXP Semiconductors
Description ESD protection
PUSB3FR6 page 2 PUSB3FR6 page 3

PUSB3FR6 Overview

The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB bination, SD-memory card 3.0 and thunderbolt interfaces against ElectroStatic Discharge (ESD). The device includes six high-level ESD protection diode structures for ultra high-speed signal lines. The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1) Surface-Mounted Device (SMD) plastic package.

PUSB3FR6 Key Features

  • System-level ESD protection for USB 2.0 and USB 3.1 bination, SD-memory card and thunderbolt interfaces
  • Supports SuperSpeed USB 3.1 at 10 Gbps
  • All signal lines with integrated rail-to-rail clamping diodes for downstream
  • Matched 0.5 mm trace spacing
  • Line capacitance of only 0.35 pF for each channel
  • Design-friendly ‘pass-through’ signal routing

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