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SOD323 Datasheet Surface-mounted Package

Manufacturer: NXP Semiconductors

Overview: SOD323 plastic, surface-mounted package; 2 terminals; 1.7 mm x 1.25 mm x 0.95 mm body 9 January 2017 Package information 1. Package summary Dimensions (mm) 1.7 x 1.25 x 0.

General Description

plastic, surface-mounted package;

2 terminals;

1.7 mm x 1.25 mm x 0.95 mm body Package style descriptive code SOD (small outline diode) Package body material type P JEITA package outline code SC-76 Handling precautions IC26_CHAPTER_3_2000 Thermal design considerations SC18_1999_CHAPTER_5_2 Mounting method type S (surface mount) Generic mounting and soldering information AN10365_3 Reflow soldering footprint SOD323_fr Wave soldering footprint SOD323_fw Package life cycle status REL Major version date 18-9-2008 Minor version date 6-7-2012 Security status PANY PUBLIC

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