SOD323
SOD323 is surface-mounted package manufactured by NXP Semiconductors.
description plastic, surface-mounted package; 2 terminals; 1.7 mm x 1.25 mm x 0.95 mm body
Package style descriptive code
SOD (small outline diode)
Package body material type
JEITA package outline code
SC-76
Handling precautions
IC26_CHAPTER_3_2000
Thermal design considerations
SC18_1999_CHAPTER_5_2
Mounting method type
S (surface mount)
Generic mounting and soldering information AN10365_3
Reflow soldering footprint
SOD323_fr
Wave soldering footprint
SOD323_fw
Package life cycle status
Major version date
18-9-2008
Minor version date
6-7-2012
Security status
PANY...
