OSD3358
Overview
The OSD335x C-SiP System-In-Package (SiP) is a self-contained computing system ideal to power the latest embedded applications. It integrates the powerful 1GHz Sitara™ ARM® Cortex®-A8 AM335x Processor from Texas Instruments, up to 1 Gigabyte (GB) of DDR3L memory, up to 16 Gigabytes (GB) of embedded Multimedia Card (eMMC) non-volatile memory, a low power, low jitter MEMs Oscillator, 4 Kilobytes (KB) EEPROM, TPS65217C PMIC, TL5209 LDO, and resistors, capacitors, and inductors into a single 27mm x 27mm easy to use IC package.
- TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, eMMC, MEMS Oscillator and passive components integrated into a single package
- TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x 2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x3 o LCD Controller o SGX 3D Graphics Engine o PRU Subsystem OSD335x C-SiP Block Diagram
- Access to all* AM335x Peripherals: CAN, SPI, UART, I2C, GPIO, etc.
- Up to 1GB DDR3
- Up to 16GB eMMC
- Low Power, Low Jitter MEMS Oscillator
- PWR In: AC Adapter, USB or Single cell (1S) Li-Ion / Li-Po Battery
- PWR Out: 1.8V, 3.3V and SYS
- Selectable I/O Voltage: 1.8V or 3.3V Benefits
- Integrates over 100 components
