OSD3358 Description
OSD335x C-SiP Family Rev. 9 10/5/2022 Introduction The OSD335x C-SiP System-In-Package (SiP) is a self-contained puting system ideal to power the latest embedded applications. With this level of integration, the OSD335x C-SiP has everything needed to build a plete embedded puting platform.
OSD3358 Key Features
- TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, eMMC, MEMS Oscillator and passive ponents integrated into a single package
- Access to all- AM335x Peripherals: CAN, SPI, UART, I2C, GPIO, etc
- Up to 1GB DDR3
- Up to 16GB eMMC
- Low Power, Low Jitter MEMS Oscillator
- PWR In: AC Adapter, USB or Single cell
- PWR Out: 1.8V, 3.3V and SYS
- Selectable I/O Voltage: 1.8V or 3.3V
- Integrates over 100 ponents
- patible with AM335x development