ESD7M5.0DT5G Datasheet | onsemi

Features : - Low Capacitance 2.5 p F Max - Low Clamping Voltage - Small Body Outline Dimensions: 0.047” x 0.047” (1.20 mm x 1.20 mm) - Low Body Height: 0.020- (0.5 mm) - Stand- off Voltage: 5 V - Low Leakage - Response Time is Typically < 1.0 ns - IEC61000- 4- 2 Level 4 ESD Protection - This is a Pb- Free Device Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V- 0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000- 4- 2 (ESD) Contact 10 k V Total Power Dissipation on FR- 5 Board (Note 1) @ TA = 25C Storage Temperature Range Junction Temperature Range Lead Solder Temperature - Maximum (10 Second Duration) PD Tstg TJ TL 150 m W - 55 to +150 C - 55 to +125 C C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR- 5 = 1.0 x 0.75 x 0.62 in.  Semiconductor ponents Industries, LLC, 2013 February, 2024 - Rev. 7 DATA SHEET .onsemi. PIN 1. CATHODE...