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FDG6332C - Dual-Channel MOSFET

Datasheet Summary

Description

The N & P Channel MOSFETs are produced using onsemi advanced POWERTRENCH process that has been especially tailored to minimize on

state resistance and yet maintain superior switching performance.

Features

  • Q1 0.7 A, 20 V  RDS(ON) =300 mW @ VGS = 4.5 V  RDS(ON) = 400 mW @ VGS = 2.5 V.
  • Q2.
  • 0.6 A,.
  • 20 V  RDS(ON) = 420 mW @ VGS =.
  • 4.5 V  RDS(ON) = 630 mW @ VGS =.
  • 2.5 V.
  • Low Gate Charge.
  • High Performance Trench Technology for Extremely Low RDS(ON).
  • SC70.
  • 6 Package: Small Footprint (51% Smaller than SSOT.
  • 6); Low Profile (1 mm Thick).
  • ESD Protection Level: HBM >75 V, MM >25 V, CDM >1.5 kV.
  • These Devices are Pb.

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Datasheet preview – FDG6332C

Datasheet Details

Part number FDG6332C
Manufacturer ON Semiconductor
File Size 279.21 KB
Description Dual-Channel MOSFET
Datasheet download datasheet FDG6332C Datasheet
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Full PDF Text Transcription

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DATA SHEET www.onsemi.com MOSFET – N & P-Channel, POWERTRENCH) 20 V FDG6332C General Description The N & P−Channel MOSFETs are produced using onsemi advanced POWERTRENCH process that has been especially tailored to minimize on−state resistance and yet maintain superior switching performance. These devices have been designed to offer exceptional power dissipation in a very small footprint for applications where the bigger more expensive TSSOP−8 and SSOP−6 packages are impractical. Features  Q1 0.7 A, 20 V  RDS(ON) =300 mW @ VGS = 4.5 V  RDS(ON) = 400 mW @ VGS = 2.5 V  Q2 −0.6 A, −20 V  RDS(ON) = 420 mW @ VGS = −4.5 V  RDS(ON) = 630 mW @ VGS = −2.
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