NRVBM110LT1G Datasheet | onsemi

MBRM110LT1G, NRVBM110LT1G, NRVBM110LT3G Surface Mount Schottky Power Rectifier POWERMITE Power Surface Mount Package The Schottky POWERMITE employs the Schottky Barrier principle with a barrier metal and epitaxial construction that produces optimal forward voltage drop- reverse current tradeoff. The advanced packaging techniques provide for a highly efficient micro miniature, space saving surface mount Rectifier. With its unique heatsink design, the POWERMITE has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles,  1.1 mm in the industry. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook puters, printers, PDAs and PCMCIA cards. Typical applications are AC- DC and DC- DC converters, reverse battery protection, and “ORing” of multiple supply voltages and any other application where performance and size are critical. Features - Ultra Low VF - 1st in Marketplace with a 10 VR Schottky Rectifier - Low Profile - Maximum Height of 1.1 mm - Small Footprint - Footprint Area of 8.45 mm2 - Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink - ESD Ratings:  Human Body Model > 4000 V (Class 3)  Machine Model > 400 V (Class C) - AEC- Q101 Qualified and PPAP Capable - NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements - All Packages are Pb- Free- Mechanical Characteristics: - POWERMITE is JEDEC Registered as D0- 216AA - Case: Molded Epoxy - Epoxy Meets UL 94 V- 0 @ 0.125 in - Weight: 62 mg (Approximately) - Lead and Mounting Surface Temperature for Soldering Purposes: 260C Maximum for 10 Seconds - For additional information on our Pb- Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.  Semiconductor ponents Industries, LLC,...