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NTHS4501N Power MOSFET
30 V, 6.7 A, Single N−Channel, ChipFETt Package
Features
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• Planar Technology Device Offers Low RDS(on) and Fast Switching Speed • Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6. • •
Ideal Device for Applications Where Board Space is at a Premium. ChipFET Package Exhibits Excellent Thermal Capabilities Where Heat Transfer is Required. Pb−Free Package is Available in a ChipFET Package
V(BR)DSS 30 V
RDS(on) Typ 30 mW @ 10 V 40 mW @ 4.5 V
ID Max 6.
NTHS4501N Datasheet
