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NTHS4501N - Power MOSFET

Key Features

  • www. DataSheet4U. com http://onsemi. com.
  • Planar Technology Device Offers Low RDS(on) and Fast Switching Speed.
  • Leadless ChipFET Package has 40% Smaller Footprint than TSOP.
  • 6.
  • Ideal Device for.

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NTHS4501N Power MOSFET 30 V, 6.7 A, Single N−Channel, ChipFETt Package Features www.DataSheet4U.com http://onsemi.com • Planar Technology Device Offers Low RDS(on) and Fast Switching Speed • Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6. • • Ideal Device for Applications Where Board Space is at a Premium. ChipFET Package Exhibits Excellent Thermal Capabilities Where Heat Transfer is Required. Pb−Free Package is Available in a ChipFET Package V(BR)DSS 30 V RDS(on) Typ 30 mW @ 10 V 40 mW @ 4.5 V ID Max 6.