NTMD3P03 Overview
Key Specifications
Package: SOIC
Mount Type: Surface Mount
Pins: 8
Height: 1.5 mm
Key Features
- High Efficiency Components in a Dual SOIC-8 Package
- High Density Power MOSFET with Low RDS(on)
- Miniature SOIC-8 Surface Mount Package
- Saves Board Space
- Diode Exhibits High Speed with Soft Recovery
- IDSS Specified at Elevated Temperature
- Avalanche Energy Specified
- Mounting Information for the SOIC-8 Package is Provided
- AEC-Q101 Qualified
- These Devices are Pb-Free and are RoHS Compliant
