NTMS3P03R2 Overview
Key Specifications
Package: SOIC
Mount Type: Surface Mount
Pins: 8
Height: 1.75 mm
Key Features
- ăHigh Efficiency Components in a Single SOIC-8 Package
- ăHigh Density Power MOSFET with Low RDS(on)
- ăMiniature SOIC-8 Surface Mount Package
- Saves Board Space
- ăDiode Exhibits High Speed with Soft Recovery
- ăIDSS Specified at Elevated Temperature
- ăAvalanche Energy Specified
- ăMounting Information for the SOIC-8 Package is Provided
- ăPb-Free Package is Available
