NUF4105FC Datasheet | onsemi

Features http://onsemi. CIRCUIT DESCRIPTION A1 D1 C1 R2 A2 D3 C3 R3 A3 D5 C5 R4 A4 D7 C7 R5 A5 D9 C9 C10 D10 C5 C8 D8 B2 C4 C6 D6 C3 C4 D4 B1 C2 C2 D2 C1 - - - - - - - - - - - EMI Filtering and ESD Protection for Data Lines Integration of 26 Discretes Offers Cost and Space Savings Exceeds IEC61000- 4- 2 (Level 4) Specifications Low Profile Flip- Chip Packaging MSL 1 300 mm Solder Spheres (NUF4105), Case 499D EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook puters MP3 Players Typical Applications MAXIMUM RATINGS (TA = 25°C) Rating ESD Discharge IEC61000- 4- 2, - Air Discharge - Contact Discharge Human Body Model DC Power per Resistor DC Power per Package Junction Temperature Operating Temperature Range Storage Temperature Range Symbol VPP 30 30 16 PR PT TJ Top Tstg 100 400 150 - 40 to +85 - 55 to +150 m W m W °C °C °C Value Unit k V A6 D11 C11 C12 D12 B3 C6 A1 FLIP- CHIP CASE 499D 300 mm Bumps DEVICE MARKING NUF4105YYWW YY = Year WW = Work Week Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ORDERING INFORMATION Device NUF4105FCT1 Package Flip- Chip Shipping† 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor ponents Industries, LLC, 2004 November, 2004 - Rev. 1 Publication Order Number: NUF4105FC/D ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol VBR IR RI/O Cline IZ = 10 m A VRM = 3.3 V per line IR = 20 m A VR = 2.5 V, f = 1.0 MHz (Note 1) Characteristic Min 6.0 - 80 - Typ 7.0 - 100 53 Max 8.0 0.1 120 - Unit V m A W p F 1. Measured from input/output pins...