NUF4107FC Datasheet | onsemi

Features http://onsemi. CIRCUIT DESCRIPTION A1 D1 C1 R2 D2 D11 D3 C2 B2 C3 B3 A4 D5 C5 B4 A5 D7 C7 B5 A6 Symbol VPP Value 30 16 0.4 100 600 150 - 40 to +85 - 55 to +150 m W m W °C °C °C Unit k V FLIP- CHIP- 17 CASE 499AD A1 D9 C9 R6 C10 C6 D10 R5 C8 C5 D8 R4 C6 C4 D6 R3 C4 C3 D4 B1 C2 R1 C1 R7 - - - - - - - - - - - - - - EMI Filtering and ESD Protection for Data Lines USB 1.1 Filtering Provided with Speed Detection Integration of 27 Discretes Offers Cost and Space Savings 350 mm Solder Spheres All TVS Protected Inputs ply with IEC61000- 4- 2 (Level 4) 30 k V (Contact) 30 k V (Air) Low Profile Flip- Chip Packaging MSL 1 All Pins Exceed 2000 V Human Body Model (Note 1) Pb- Free Package is Available- EMI and USB Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook puters MP3 Players Rating ESD Discharge IEC61000- 4- 2 (Note 1) - Air Discharge, Contact Discharge Human Body Model Machine Model DC Power per Resistor DC Power per Package Junction Temperature Operating Temperature Range Storage Temperature Range A2 A3 Typical Applications MAXIMUM RATINGS (TA = 25°C) PR PT TJ Top Tstg È È MARKING DIAGRAM Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Remended Operating Conditions is not implied. Extended exposure to stresses above the Remended Operating Conditions may affect device reliability. 1. This does not include Pins B1, C1 and C2 4107 = Device Code A = Assembly Location 4107AYWW G Y = Year G WW = Work Week G = Pb- Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device NUF4107FCT1 NUF4107FCT1G Package Flip- Chip Flip- Chip (Pb- Free) Shipping† 3000 Tape & Reel 3000 Tape & Reel - For additional information on our Pb- Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. †For information on tape and reel specifications, including part orientation and...