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NXH50C120L2C2ES1G - TMPIM 50A CIB/CI Module

Download the NXH50C120L2C2ES1G datasheet PDF. This datasheet also covers the NXH50C120L2C2ESG variant, as both devices belong to the same tmpim 50a cib/ci module family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Low Thermal Resistance Substrate for Low Thermal Resistance.
  • Lower Package Height than Standard Case Modules.
  • 6 mm Clearance distance between pin to heatsink.
  • Compact 73 mm × 40 mm × 8 mm Package.
  • Solderable Pins.
  • Thermistor.
  • These Devices are Pb.
  • Free, Halogen Free/BFR Free and are RoHS Compliant Typical.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (NXH50C120L2C2ESG-ONSemiconductor.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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TMPIM 50 A CIB/CI Module NXH50C120L2C2ESG, NXH50C120L2C2ES1G The NXH50C120L2C2ESG is a transfer−molded power module with low thermal resistance substrate containing a converter-inverter-brake circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, one 35 A, 1200 V brake IGBT with brake diode and an NTC thermistor. The NXH50C120L2C2ES1G is a transfer−molded power module with low thermal resistance substrate containing a converter−inverter circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, and an NTC thermistor.