NXH50C120L2C2ES1G Overview
Key Features
- Low - Lower Package Height than Standard Case Modules
- 6 mm Clearance distance between pin to heatsink
- Compact 73 mm × 40 mm × 8 mm Package
- Solderable Pins
- These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
