NXH50C120L2C2ESG Datasheet | onsemi

TMPIM 50 A CIB/CI Module NXH50C120L2C2ESG, NXH50C120L2C2ES1G The NXH50C120L2C2ESG is a transfer- molded power module with low thermal resistance substrate containing a converter-inverter-brake circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, one 35 A, 1200 V brake IGBT with brake diode and an NTC thermistor. The NXH50C120L2C2ES1G is a transfer- molded power module with low thermal resistance substrate containing a converter- inverter circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, and an NTC thermistor. Features - Low Thermal Resistance Substrate for Low Thermal Resistance - Lower Package Height than Standard Case Modules - 6 mm Clearance distance between pin to heatsink - pact 73 mm × 40 mm × 8 mm Package - Solderable Pins - Thermistor - These Devices are Pb- Free, Halogen Free/BFR Free and are Ro HS pliant Typical Applications - Industrial Motor Drives - Servo Drives DBPLUS P .onsemi. DIP26 67.8x40 CASE 181AD MARKING DIAGRAM DBMINUS Figure 1. NXH50C120L2C2ESG Schematic Diagram DBPLUS P TH1 TH2 ORDERING INFORMATION Device Package Shipping† DIP26 NXH50C120L2C2ES1G (Pb- Free) 6 Units /...