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NXH50C120L2C2ESG - TMPIM 50A CIB/CI Module

Key Features

  • Low Thermal Resistance Substrate for Low Thermal Resistance.
  • Lower Package Height than Standard Case Modules.
  • 6 mm Clearance distance between pin to heatsink.
  • Compact 73 mm × 40 mm × 8 mm Package.
  • Solderable Pins.
  • Thermistor.
  • These Devices are Pb.
  • Free, Halogen Free/BFR Free and are RoHS Compliant Typical.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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TMPIM 50 A CIB/CI Module NXH50C120L2C2ESG, NXH50C120L2C2ES1G The NXH50C120L2C2ESG is a transfer−molded power module with low thermal resistance substrate containing a converter-inverter-brake circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, one 35 A, 1200 V brake IGBT with brake diode and an NTC thermistor. The NXH50C120L2C2ES1G is a transfer−molded power module with low thermal resistance substrate containing a converter−inverter circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, and an NTC thermistor.