PZT751T1
PZT751T1 is PNP Transistor manufactured by onsemi.
Features http://onsemi. thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die ..
- NPN plement is PZT651T1
- Pb- Free Package is Available
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating Collector- Emitter Voltage Collector- Base Voltage Emitter- Base Voltage Collector Current Total Power Dissipation @ TA = 25°C(1) Derate above 25°C Storage Temperature Range Junction Temperature Symbol VCEO VCBO VEBO IC PD Tstg TJ Value 60 80 5.0 2.0 0.8 6.4
- 65 to 150 150 Unit Vdc Vdc Vdc Adc W m W/°C °C °C
- High Current: 2.0 A
- The SOT- 223 Package can be soldered using wave or reflow.
- SOT- 223 package ensures level mounting, resulting in improved
SOT- 223 PACKAGE HIGH CURRENT PNP SILICON TRANSISTOR SURFACE MOUNT
COLLECTOR 2, 4 BASE 1 EMITTER 3
MARKING DIAGRAM
TO- 261AA CASE 318E STYLE 1
D ZT 751
THERMAL CHARACTERISTICS
Rating Thermal Resistance from Junction- to- Ambient in Free Air Maximum Temperature for Soldering Purposes Time in Solder Bath Symbol Rq JA TL Value 156 260 10 Unit °C/W °C Sec
ZT 751 = Specific Device Code D = Date Code
ORDERING INFORMATION
Device PZT751T1 PZT751T1G Package SOT- 223 SOT- 223 (Pb- Free) Shipping 1000 / Tape & Reel 1000 / Tape & Reel
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Device mounted on a FR- 4 glass epoxy printed circuit board using minimum remended footprint.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred devices are remended choices for future use and best overall value.
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