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MMFT960T1 - Power MOSFET 300 mA / 60 Volts

Features

  • ring a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph s.

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Datasheet Details

Part number MMFT960T1
Manufacturer ON
File Size 78.40 KB
Description Power MOSFET 300 mA / 60 Volts
Datasheet download datasheet MMFT960T1 Datasheet

Full PDF Text Transcription

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MMFT960T1 Preferred Device Power MOSFET 300 mA, 60 Volts N–Channel SOT–223 This Power MOSFET is designed for high speed, low loss power switching applications such as switching regulators, dc–dc converters, solenoid and relay drivers. The device is housed in the SOT–223 package which is designed for medium power surface mount applications. • Silicon Gate for Fast Switching Speeds • Low Drive Requirement • The SOT–223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering eliminating the possibility of damage to the die. MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Drain–to–Source Voltage Gate–to–Source Voltage – Non–Repetitive Drain Current Total Power Dissipation @ TA = 25°C (Note 1.
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