Download FDC8602 Datasheet PDF
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FDC8602 Description

This N−Channel MOSFET is produced using onsemi‘s advanced POWERTRENCH process that incorporates Shielded Gate technology. This process has been optimized for RDS(on), switching performance and ruggedness.

FDC8602 Key Features

  • Shielded Gate MOSFET Technology
  • Max RDS(on) = 350 mW at VGS = 10 V, ID = 1.2 A
  • Max RDS(on) = 575 mW at VGS = 6 V, ID = 0.9 A
  • High Performance Trench Technology for Extremely Low RDS(on)
  • High Power and Current Handling Capability in a Widely Used
  • Fast Switching Speed
  • 100% UIL Tested
  • This Device is Pb-Free, Halide Free and is RoHS pliant