MMBZ5251BTW Overview
Key Features
- Planar Die Construction
- 200mW Power Dissipation
- Zener Voltages from 2.4~51V
- Ideally Suited for Automated Assembly Processes
- In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
- Case: SOT-363, Plastic
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 0.0002 ounces, 0.006 grams
