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MMBZ5257BTW - SURFACE MOUNT SILICON ZENER DIODES

This page provides the datasheet information for the MMBZ5257BTW, a member of the MMBZ5221BTW SURFACE MOUNT SILICON ZENER DIODES family.

Datasheet Summary

Features

  • Planar Die Construction.
  • 200mW Power Dissipation.
  • Zener Voltages from 2.4~51V.
  • Ideally Suited for Automated Assembly Processes.
  • In compliance with EU RoHS 2002/95/EC directives.

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Datasheet preview – MMBZ5257BTW

Datasheet Details

Part number MMBZ5257BTW
Manufacturer PAN JIT
File Size 229.12 KB
Description SURFACE MOUNT SILICON ZENER DIODES
Datasheet download datasheet MMBZ5257BTW Datasheet
Additional preview pages of the MMBZ5257BTW datasheet.

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Full PDF Text Transcription

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MMBZ5221BTW~MMBZ5262BTW SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 51 Volts POWER 200 mWatts FEATURES • Planar Die Construction • 200mW Power Dissipation • Zener Voltages from 2.4~51V • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: SOT-363, Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.0002 ounces, 0.006 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TJ=25OC unless otherwise noted) PARAMETER Power Dissipation (Note A) Peak Forward Surge Current,8.3ms single half sine-wave superimposed on rated load (JEDEC method) (Notes B) Operating Junction Temperature and Storage Temperature Range SYMBOL PD IFS M TJ ,TSTG VALUE 200 2.0 -55 to +150 UNITS mW A OC NOTES: A.
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