GS1J
Overview
- For surface mounted applications in order to optimize board space
- Easy pick and place
- Plastic package has Underwriters Laboratory Flammability Classification 94V-O
- Low Forward Drop
- High temperature soldering : 260°C /10 seconds at terminals
- Glass Passivated Chip Junction
- Lead free in compliance with EU RoHS 2.0
- Green molding compound as per IEC 61249 standard
