GS1JAFC-AU
Overview
- Glass passivated chip junction
- Low forward voltage drop
- Low leakage current
- AEC-Q101 qualified
- Lead free in compliance with EU RoHS 2.0
- Green molding compound as per IEC 61249 standard SMAF-C Mechanical Data
- Case : Molded plastic, SMAF-C
- Terminals : Solderable per MIL-STD-750, Method 2026
- Approx. Weight : 0.0012 ounces, 0.034 grams
