MMBTA55 Datasheet | PanJit Semiconductor

Features - NPN and PNP silicon, planar design - Collector current IC = 500m A - Lead free in pliance with EU Ro HS 2.0 - Green molding pound as per IEC 61249 standard 0.120(3.04) 0.110(2.80) 0.056(1.40) 0.047(1.20) 0.079(2.00) 0.070(1.80) Mechanical Data - Case : SOT-23 Package - Terminals : Solderable per MIL-STD-750, Method 2026 - Approx. Weight : 0.0084 grams 0.004(0.10) 0.000(0.00) 0.020(0.50) 0.013(0.35) 0.006(0.15)MIN. Unit: inch(mm) 0.008(0.20) 0.003(0.08) 0.044(1.10) 0.035(0.90) Maximum Ratings and Thermal Characteristics (TA=25o C unless otherwise noted) PARAMETER Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current-Continuous Circuit Figure SYMBOL VCEO VCBO VEBO IC MMBTA05 MMBTA55 MMBTA06 MMBTA56 UNITS V V V m A Maximum Ratings and Thermal Characteristics (TA=25o C unless otherwise noted) CHARACTERISTIC SYMBOL Total device dissipation FR-4 board (Note 1) TA=25o C PD derate above 25o C Typical thermal resistance RθJA Total device dissipation alumina substrate (Note 2) TA=25o C PD derate above 25o C Typical thermal resistance RθJA Operating junction and storage temperature range TJ, TSTG MAX. 225 1.8 556 300 2.4 417 -55 to 150 UNITS m W m W/ o C o C/W m W m W/ o C o C/W o C NOTES : 1. FR-4=70 x 60 x 1mm. 2. Alumina=0.4 x 0.3 x 0.024 in. 99.5...