P6SMB8.2
Key Features
- For surface mounted applications in order to optimize board space.
- Glass passivated junction
- Low inductance
- Plastic package has Underwriters Laboratory Fammability Classification 94V-O
- High temperature soldering : 260°C /10 seconds at terminals
- Lead free in compliance with EU RoHS 2011/65/EU directives
- Green molding compound as per IEC61249 Std. . (Halogen Free) 0.083(2.11) 0.075(1.91) 0.185(4.70) 0.160(4.06) 0.155(3.94) 0.130(3.30) 0.012(0.305) 0.006(0.152) 0.096(2.44) 0.083(2.13)
