Power Mount CSP Packaging (PMCP) that is comprised of a unique pad design and drain clip technology. This allows for a 5% improvement in thermal dissipation while simultaneously reducing the size by 80% over the conventional solutions. Panasonic’s advances in cell technology and wafer thinning fabrication have lead to silicon with a 110nm fine trench cell that provides 47% lower RDS(on) over the same sized conventional chip. By using this technology, this MOSFET Series achieves higher power eff.
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New Product Introduction NEW! FJ3P02100L & FK3P02110L Series Power CSP MOSFET’s With Panasonic’s Advanced 110nm Fine Trench Cell Silicon Technology Panasonic, a worldwide...
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anced 110nm Fine Trench Cell Silicon Technology Panasonic, a worldwide leader in Semiconductor Products, is pleased to announce the NEW FJ3P02100L and FK3P02110L Series of Power CSP MOSFET’s. The NEW POWER CSP MOSFET Series features Power Mount CSP Packaging (PMCP) that is comprised of a unique pad design and drain clip technology. This allows for a 5% improvement in thermal dissipation while simultaneously reducing the size by 80% over the conventional solutions. Panasonic’s advances in cell technology and wafer thinning fabrication have lead to silicon with a 110nm fine trench cell that provides 47% lower RDS(on) over th
FJ3P02100L Datasheet