FJ3P02100L Overview
Key Specifications
Package: SMD/SMT
Mount Type: Surface Mount
Pins: 3
Height: 330 µm
Key Features
- Power Mount CSP (PMCP) Package Allows For Improved Thermal Dissipation By 5% While Reducing The Size By 80% Over the Conventional Solutions
- RDS(on): FJ3P02100L: 9.5mΩ@VGS=4.5V(typ.) FK3P02110L: 12.5mΩ@VGS=2.5V(typ.)
- Lead-free Solder Bumps, Halogen Free, RoHS Qualified
- AEC-Q101 Qualified
