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BGW200

Manufacturer: Philips Semiconductors (now NXP Semiconductors)

BGW200 datasheet by Philips Semiconductors (now NXP Semiconductors).

BGW200 datasheet preview

BGW200 Datasheet Details

Part number BGW200
Datasheet BGW200_Philips.pdf
File Size 128.84 KB
Manufacturer Philips Semiconductors (now NXP Semiconductors)
Description Low Power WLAN SiP
BGW200 page 2 BGW200 page 3

BGW200 Overview

BGW200 Low-power WLAN SiP Optimized for low-power mobile applications, this plete, single-package 802.11b solution bines a baseband/MAC, RF transceiver, and power amplifier into an ultra-small (150 mm2) package. It delivers the industry’s lowest power consumption in standby mode and supports coexistence with Bluetooth® solutions. plete, single-package 802.11b solution for mobile handheld devices Semiconductors The...

BGW200 Key Features

  • Advanced, single-package WLAN SiP optimized for mobile handheld devices
  • No RF-critical design required
  • Low total cost of ownership
  • Lowest power consumption in standby mode: < 2 mW (typ)
  • Ultra-small form factor
  • Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)
  • Only three external ponents for entire solution
  • Host processor sleeps while BGW200 processes beacons
  • BGW200 wakes the host processor only upon data packet arrival
Philips Semiconductors (now NXP Semiconductors) logo - Manufacturer

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BGW200 Distributor

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