BGW200 Datasheet | Philips Semiconductors

features - Advanced, single-package WLAN Si P optimized for mobile handheld devices - No RF-critical design required - Low total cost of ownership - Lowest power consumption in standby mode: < 2 m W (typ) - Ultra-small form factor - Low-profile 68-pin HVQFN-like Si P package (10 x 15 x 1.3 mm) - Only three external ponents for entire solution - “No Host Load” design delivers easy integration and longer battery life - Host processor sleeps while BGW200 processes beacons - BGW200 wakes the host processor only upon data packet arrival - Co-exists with Bluetooth 1.1 and 1.2 - plete software drivers, utility, and diagnostic tools Ultra-small footprint, ultra-low power consumption The BGW200 uses a single, 68-pin HVQFN-like package that measures only 10 x 15 x 1.3 mm. The entire 802.11b solution requires only three external ponents and uses less than 180 mm2 of circuit board area. The BGW200 incorporates several features that decreases power consumption. There is an integrated ARM7 processor, 1.25 Mbytes of SRAM, 256 Kbytes of ROM, optimized host interfaces (SDIO/SPI), and integrated power management hardware/software algorithms. The result is the lowest standby power consumption in the industry (less than 2 m W). Applications - Smartphones, cellular phones, Vo IP wireless phones - PDAs, handheld puting devices, WLAN adapter cards (Secure Digital) - Portable audio/video devices, MP3 players - Other handhelds and electronic devices for wireless digital, audio, multimedia, and telephony Superior “No Host Load” Architecture The BGW200 is designed to...