BGW211 - Low Power WLAN SiP

Datasheet Summary

Description

Low-power 802.11g SiP Size 10 x 15 x 1.3 mm Part number BGW211 Philips Semiconductors Philips Semiconductors is a

Features

Advanced, single-package WLAN 802.11g optimized for mobile handheld devices.
No RF-critical design required.
Low total cost of ownership.
Lowest-power consumption in standby (< 2 mW) and operating modes (PA, RF, baseband/MAC).
Ultra-small form factor.
Low-proﬁle 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm).
No external components required.
Ideal mobile architecture.
No WLAN related processor load in all operati.

Philips

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Datasheet Details

Part number	BGW211
Manufacturer	Philips
File Size	163.08 KB
Description	Low Power WLAN SiP
Datasheet	BGW211 Datasheet
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BGW211 Low-power WLAN SiP Optimized for use in battery-powered handheld devices, the BGW211 System-in-a-Package (SiP) delivers complete 802.11g functionality with the industry’s lowest standby and operating power consumption. It requires no external components and uses only 150 mm2 of board area for the total 802.11g solution. Complete, single-package 802.11g solution for mobile phones and portable consumer devices Semiconductors The BGW211 is Philips’ third-generation System-in-a-Package (SiP) solution for low-power 802.11 Wireless LAN (WLAN). Supporting complete 802.11g functionality, it enables consumers to access data and multimedia content through WLAN networks up to ﬁve times faster than current 802.11b products without compromising battery life.

Published: Jul 18, 2005 |