Datasheet4U Logo Datasheet4U.com

BGW211 Datasheet Low Power WLAN SiP

Manufacturer: Philips Semiconductors (now NXP Semiconductors)

Overview: BGW211 Low-power WLAN SiP Optimized for use in battery-powered handheld devices, the BGW211 System-in-a-Package (SiP) delivers complete 802.11g functionality with the industry’s lowest standby and operating power consumption. It requires no external components and uses only 150 mm2 of board area for the total 802.11g solution. Complete, single-package 802.11g solution for mobile phones and portable consumer devices Semiconductors The BGW211 is Philips’ third-generation System-in-a-Package (SiP) solution for low-power 802.11 Wireless LAN (WLAN). Supporting complete 802.11g functionality, it enables consumers to access data and multimedia content through WLAN networks up to five times faster than current 802.11b products without compromising battery life. The BGW211 delivers industry-leading standby and operating power in a package that measures only 150 mm2 and requires no external components for operation. Extensive support for Quality of Service (QoS) and coexistence with Bluetooth wireless make it robust enough for very demanding portable applications.

📥 Download Datasheet

Key Features

  • Advanced, single-package WLAN 802.11g optimized for mobile handheld devices.
  • No RF-critical design required.
  • Low total cost of ownership.
  • Lowest-power consumption in standby (< 2 mW) and operating modes (PA, RF, baseband/MAC).
  • Ultra-small form factor.
  • Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm).
  • No external components required.
  • Ideal mobile architecture.
  • No WLAN related processor load in all operati.

BGW211 Distributor & Price

Compare BGW211 distributor prices and check real-time stock availability from major suppliers. Prices and inventory may vary by region and order quantity.

More Datasheets from Philips Semiconductors (now NXP Semiconductors)

Part Number Description
BGW200 Low Power WLAN SiP