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PDF: 2002 Jun 07
Philips Semiconductors
Package outline
LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
SOT389-1
c
y X
A 33 34 23 22 ZE
e E HE w M bp 44 1 bp D HD w M 11 ZD B v M B v M A 12 detail X L Lp A A2 A1 pin 1 index (A 3) θ
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.45 0.30 c 0.20 0.12 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.2 y 0.1 Z D (1) Z E (1) 1.14 0.85 1.14 0.85 θ 7 0o
o
12.15 12.15 11.85 11.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT389-1 REFERENCES IEC 136E08 JEDEC MS-026 JEITA EUROPEAN PROJECTION
ISSUE DATE 00-01-19 02-06-07
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LQFP44 Datasheet
