| Part Number | LQFP44 |
|---|---|
| Manufacturer | ZMD |
| Overview | ZMD-Standard April 2002 Package LQFP44 (10 x 10) Dimensions in millimetres Based on JEDEC JEP95: MS-026 1 Dimensions MDS 758 Supersedes Edition 12.99 Z A2 A 0,1 Detail Z bp 0,2 M 44 1 D HD . s Edition 12.99 Z A2 A 0,1 Detail Z bp 0,2 M 44 1 D HD Dimensions of Sub-Group B1 enom Amax bPmin bPmax HEmin HEmax HDmin HDmax LPmin 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form £ 0,5 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 0,80 1,60 0,. |
LQFP44 Datasheet
The LQFP44 is a Package.
| Part Number | LQFP44 |
|---|---|
| Description | SMD Adapter Board |
| Manufacturer | Unknown Manufacturer |
| Overview |
The PCB-TQFP44 adapter module is designed to convert integrated circuits (IC) in 44-pin QFP/LQFP/TQFP packages to a top mounted module. This adapter was designed for engineers, students and hobbyists .
* * * * * * * * * * SMD/SMT QFP44/LQFP44/TQFP44 packages with 10x10mm body size and 0.8mm pitch Double rows standard 2.54mm pitch header pins (drill 0.8mm) Small and compact in size 41x41mm Board thickness 1.2mm White marking print High quality FR4 material Copper final thickness 35µm Green solder-s. |
| Part Number | LQFP44 |
|---|---|
| Description | PC board footprint |
| Manufacturer | Philips Semiconductors |
| Overview | Philips Semiconductors PC board footprint Footprint information for reflow soldering of LQFP44 package SOT389-1 Hx Gx P2 P1 (0.125) Hy Gy By Ay C D2 (8×) Bx Ax Generic footprint pattern D1 . . |
| Part Number | LQFP44 |
|---|---|
| Description | Package outline |
| Manufacturer | Philips Semiconductors |
| Overview | PDF: 2002 Jun 07 Philips Semiconductors Package outline LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm SOT389-1 c y X A 33 34 23 22 ZE e E HE w M bp 44 1 bp D H. . |