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UAA3587 - single-package GSM/GPRS/EDGE RF transceiver

Key Features

  • Advanced, single-package RF transceiver for GSM/GPRS/EDGE - 30% smaller than previous best-in-class solutions - Total RF front-end < 2.5 cm2.
  • Eliminates 35 external components - Integrated Tx baluns, loop filters, decoupling capacitors - Integrated Fractional-N RF synthesizer with AFC control - Semi-integrated 26-MHz oscillator with integrated supply regulator.
  • Superior performance from optimal process technologies - 0.25µm QUBiC4 BiCMOS for RF performance - Passive i.

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Other Datasheets by Philips Semiconductors (now NXP Semiconductors)

Part Number Description
UAA3580 Wideband code division multiple access frequency division duplex zero IF receiver
UAA3500HL Pager receiver
UAA3515A 900 MHz analog cordless telephone IC
UAA3522HL Low power dual-band GSM transceiver with an image rejecting front-end
UAA3535HL Low power GSM/DCS/PCS multi-band transceiver
UAA3536HN Low power GSM/DCS/PCS multi-band transceiver
UAA3540TS DECT receiver
UAA3545 Fully integrated DECT transceiver
UAA3592 Wideband Code Division Multiple / Access Frequency Division Duplex / Power Amplifier
UAA3201T UHF/VHF remote control receiver

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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UAA3587 RF SiP Integrating passive and active components into a single package, this complete RF transceiver improves performance while eliminating 35 external components and enabling an RF front-end of less than 2.5 cm2. Complete, single-package GSM/GPRS/EDGE RF transceiver Semiconductors The UAA3587, the first Philips System-in-Package (SiP) solution to use a new silicon-based structure, is a complete RF transceiver for GSM, GPRS, and EDGE mobile phones. It uses innovative techniques to combine passive and active components in a single package, maximizing RF performance while significantly reducing external component count and overall design size. The SiP uses 35 fewer external RF components than the previous generation and enables a design area of less than 2.