BD7185AGWL Overview
Key Specifications
Mount Type: Surface Mount
Max Operating Temp: 85 °C
Min Operating Temp: -35 °C
Description
The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones. The device provides 5-Buck Converters.
Key Features
- 5-channel high-efficiency Buck Converters (16-step adjustable VO by I2C)
- 12-channel CMOS-type LDO (16-step adjustable VO by I2C)
- LDO and Buck Converter power ON/OFF control by I2C interface or external pin
- Power ON/OFF sequence
- 32.768kHz OSC and output buffer
