RT3070 - Highly integrated MAC/BBP and 2.4 GHz RF single chip

Ralink

General Description

5th F.

No.

36,Taiyuan St, Jhubei City, Hsin‐Chu, Taiwan, R.O.C.

Key Features

.
CMOS Technology with RF, Baseband, and MAC standards, delivers reliable, cost‐effective, throughput from an extended distance. Optimized RF Integrated. .
1T1R Mode with 150Mbps PHY Rate for Both .
Transmit and Receiving. Legacy and High Throughput Modes .
20MHz/40MHz Bandwidth .
Reverse Direction Grant Data Flow and Frame Aggregation .
WEP 64/128, WPA, WPA2,TKIP, AES .

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RT3070 highly integrated mac/bbp and 2.4 ghz rf single chip by Ralink - Datasheet Preview

Datasheet Details

Part number	RT3070
Manufacturer	Ralink
File Size	948.85 KB
Description	Highly integrated MAC/BBP and 2.4 GHz RF single chip
Datasheet	RT3070 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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RT3070 Datasheet Preliminary Revision September 25, 2008 Application •IEEE802.11 b/g/n Wireless Local Area Networks •USB 2.0 Wi‐Fi Dongle Features • CMOS Technology with RF, Baseband, and MAC standards, delivers reliable, cost‐effective, throughput from an extended distance. Optimized RF Integrated. • 1T1R Mode with 150Mbps PHY Rate for Both • Transmit and Receiving. Legacy and High Throughput Modes • 20MHz/40MHz Bandwidth • Reverse Direction Grant Data Flow and Frame Aggregation • WEP 64/128, WPA, WPA2,TKIP, AES • • • QoS‐WMM, WMM‐PS WPS,PIN,PBC Multiple BSSID Support • USB 2.0 • International Regulation ‐ 802.