GLZ3.0A Overview
Key Features
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
- Case: Molded Glass MINI-MELF
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 0.001 ounces, 0.03 grams
- Mounting Position: Any
- Polarity : Color band denotes cathode end
- Packing information T/R
