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GLZ3.0A Datasheet

The GLZ3.0A is a SURFACE MOUNT ZENER DIODES. Download the datasheet PDF and view key features and specifications below.

Part NumberGLZ3.0A
ManufacturerPanJit Semiconductor
Overview GLZ2.0 SERIES SURFACE MOUNT ZENER DIODES VOLTAGE 2.0 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lea.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
* Case: Molded Glass MINI-MELF
* Terminals: Solderable per MIL-STD-750, Method 2026
* Approx. Weight: 0.001 ounces, 0.03 .
Part NumberGLZ3.0A
Description500mW SURFACE MOUNT ZENER DIODE
ManufacturerWon-Top Electronics
Overview ® WON-TOP ELECTRONICS Features  Planar Die Construction  500mW Power Dissipation  2.0 – 56V Nominal Zener Voltage  Ideally Suited for Automated Assembly  For Use in Voltage Stabilizer or Referenc.
* Planar Die Construction
* 500mW Power Dissipation
* 2.0
  – 56V Nominal Zener Voltage
* Ideally Suited for Automated Assembly
* For Use in Voltage Stabilizer or Reference Mechanical Data
* Case: MiniMELF, Molded Glass
* Terminals: Plated Leads Solderable per MIL-STD-202, Method 208
* Polarity: Catho.
Part NumberGLZ3.0A
Description500mW MINI MELF ZENER DIODE
ManufacturerFrontier Electronics
Overview FRONTIER ELECTRONICS CO., LTD. 500mW MINI MELF ZENER DIODE GLZ2.0A THRU GLZ36D FEATURES ! LOW COST ! SMALL SIZE ! GLASS SEALED MECHANICAL DATA ! CASE︰MINI MELF GLASS CASE ! TERMINALS：SOLDERABLE PER . ! LOW COST ! SMALL SIZE ! GLASS SEALED MECHANICAL DATA ! CASE︰MINI MELF GLASS CASE ! TERMINALS：SOLDERABLE PER MIL-STD -202, METHOD 208 ! POLARITY：COLOR BAND DENOTES CATHODE ! MOUNTING POSITION：ANY ! WEIGHT：0.036 GRAMS SOLDERABLE ENDS 1.35 ±0.05 3.3 ±0.1 0.3 ± 0.1 CASE：DO-213AA（GL34） DIMENSIONS .
Part NumberGLZ3.0A
DescriptionSURFACE MOUNT ZENER DIODES
ManufacturerRectron
Overview SURFACE MOUNT ZENER DIODES VOLTAGE RANGE 2.0 to 56 Volts 500mWatts GLZ SERIES FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In comp.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
* Case: Molded Glass MINI-MELF
* Terminals: Solderable per MIL-STD-750, Method 2026
* Approx. Weight: 0.001 ounces, 0.03 grams.
* M.