ES1EBF Overview
Key Features
- Glass Passivated Chip Juntion
- For surface mounted applications
- Low profile package
- Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data
- Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method 2026 0.26 0.18 All Dimensions in mm
