ES1GF Overview
Key Features
- Glass Passivated Chip Juntion
- For surface mounted applications
- Low profile package
- Superfast reverse recovery time SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 0.9 1.1 0.12 0.2 All Dimensions in mm
