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PC123X1YUP0F Datasheet Photocoupler

Manufacturer: Sharp Corporation

Overview: PC123XNNSZ0F Series PC123XNNSZ0F DIP 4pin Reinforced Insulation Type Photocoupler Series.

This datasheet includes multiple variants, all published together in a single manufacturer document.

General Description

PC123XNNSZ0F Series contains an IRED optically coupled to a phototransistor.

It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.

Input-output isolation voltage(rms) is 5kV.

Key Features

  • s 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output (Viso(rms) : 5kV) 8. RoHS directive compliant.
  • Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file.

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