1N4007FL
Key Features
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- Solder dip 260 °C, 40 s
- ponent in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
- This is a Halogen Free Device
- All SMC parts are traceable to the wafer lot
- Additional testing can be offered upon request Circuit Diagram Mechanical Data
- Case: SOD-123FL molded plastic
- Terminals: Plated leads solderable per MIL-STD-750, Method 2026
