FR1B
Features
- Fast switching for high efficiency
- Low leakage current
- High forward surge capability
- Solder dip 260 °C, 40 s
- ponent in accordance to Ro HS 2002/95/EC and
- WEEE 2002/96/EC
- Glass passivated chip junction
- This is a Pb
- Free device
- All SMC parts are traceable to the wafer lot
- Additional testing can be offered upon request
Circuit Diagram
Mechanical Data
- Case: JEDEC DO-214AC molded plastic body over passivated chip
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Weight: 0.07 grams
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage DC Blocking Voltage
Maximum RMS voltage
Average forward rectified output current @TA = 90°C
Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method)
Forward Voltage
@IF =1.0A
Peak Reverse Current
@TA =...
